Events

The symposium is organized by the Fraunhofer Cluster 3D Integration in close cooperation with the "Dresdener Fraunhofer Cluster Nanoanalysis" and partly takes place together with the "International Conference on Frontier of Characterization and Metrology for Nanoelectronics" (FCMN) .

more information

The motto of this year's "European 3D TSV Summit" is "Above and Beyond TSV". High-quality speaker present a broad spectrum of innovative technologies that are applied in 3D integration and in Packaging.

The Fraunhofer Institutes IZM, ENAS, IIS/EAS and IKTS - all partners in the Fraunhofer Cluster 3D Integration - are also present on the conference's exhibition.  

Dr. Peter Schneider of Fraunhofer IIS/EAS will give a presentation from Fraunhofer perspective with the title: "Enabling 3D systems – a comprehensive approach from design to technology".

Conference Website

The partners of the Fraunhofer Clusters 3D Integration present it's research capabilities and results during the third European 3D TSV Summit (January 19-21, 2015) in Grenoble/France).

• Fraunhofer IZM - 3D Wafer Level System Integration
• Fraunhofer ENAS - 3D Integration Technologies and Applications for MEMS
  
• Fraunhofer IKTS-MD - 3D Performance and Reliability Analysis, Characterization and Metrology
• Fraunhofer IIS-EAS - Design for Advanced System Integration