3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for industry in Germany and Europe.

I’m talking about complex technology that requires diverse stakeholders to get together and achieve a common vision for the next chapter in the industry. (Heinz Kundert, Semi Europe, ‘The Battle for Progress in 3D Integration’).

To cope with the complexity of this technological approach, five Fraunhofer institutes cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. This supports the strengthening of Germany as a center of innovation and economy and its leading role as a driver for innovative products in the field of microelectronic system integration.




The Fraunhofer Cluster 3D Integration has won the “2016 3D InCites Awards for Excellence in 3D Packaging Technologies” in the category “Research Institute of the Year"!