Events

12 P.M.-6 P.M.,  HOTEL HILTON DRESDEN

We would like to invite you to attend the Symposium "3D Integration - Technology, Materials, Reliability". This symposium will provide a forum for presenting current research and for discussions on issues related to technology, materials, reliability and characterization for 3D integration, including its applications for novel products.

This symposium will bring experts from industry, research institutes and universities together to discuss emerging topics in the field of 3D integration in microelectronics. It will be a forum for networking, to strengthen existing and to establish new contacts.

The first part of the Symposium "3D Integration - Technology, Materials, Reliability" will be held together with the Focus Session "3D IC Analysis and Metrology" of the 2015 FCMN. 

Program Overview:

3D IC Analysis and Metrology (12 p.m.-4:00 p.m. // Chair: Martin Gall)

Paul S. Ho (University of Texas, Austin/TX)
Thermo-mechanical reliability of TSVs

Valeriy Sukharev (Mentor Graphics)
DFM and DFR requirements for 3D stacked systems to materials data and characterization techniques

Sesh Ramaswami (Applied Materials)
Technology requirement and process control solutions

Jürgen Gluch (Fraunhofer IKTS)
X-ray tomography for process development and failure analysis

Kris Vanstreels (IMEC)
Analytical challenges and solutions for chip-package interaction

Peter Czurratis (PVA Tepla)
New Scanning Acoustic Microscopy technologies applied to 3D integration applications

3D Cluster Session (4:30-6:00 p.m. // Chair. M.J. Wolf)

Markus Keil (HSEB Dresden GmbH)
Cost effective 100% quality control for FBeoL application

M. Juergen Wolf (Fraunhofer IZM-ASSID)
3D Integration - Status, Challenges and Requirements

Sven Rzepka (Fraunhofer ENAS)
Design for Reliability by Virtual Prototyping for 3D TSV Integration Technologies

Participants are also welcome to join the morning session of the conference Frontiers of Chracterization and Metrology for Nanoelectronics (FCMN). Starting at 7:00 pm, all participants of the Fraunhofer Symposium 3D Integration are invited to join us for a networking event, in a restaurant in Dresden downtown, with traditional Saxonian food and beverages.

• Participation Fee: 190 €
  (the registration for the 3D symposium also includes a day pass for the FCMN on April 16th)

Location: Hotel Hilton Dresden

Date: April 16th, 2015, 1:30-6:00 p.m.

Language: English